IFOC預(yù)告 | Broadcom解析下一代人工智能連接：極高密度和低功耗光學(xué)

  ICC訊 2025年9月8-9日，一年一度IFOC2025訊石光通信大會即將在深圳國際會展中心洲際酒店隆重舉辦。IFOC 2025定位中國光通信領(lǐng)域最高規(guī)格技術(shù)，市場，交流研討為一體的產(chǎn)業(yè)盛會，將攜手光電子、光通信產(chǎn)業(yè)界、學(xué)術(shù)界、投資界等合作伙伴，探索AI機遇趨勢中的光電子技術(shù)市場的機遇與挑戰(zhàn)，致力于成為光通信、光電子市場發(fā)展的風(fēng)向標(biāo)。

  在本次IFOC2025盛會上，VP of Marketing & Operations, Optical Systems Division, Broadcom(光學(xué)系統(tǒng)部 營銷與運營副總裁 博通)Manish Mehta將帶來一場題為“Enabling the Next Generation of AI Connectivity: Very High Density and Low Power Optical ”的精彩演講。

演講人：Manish Mehta

VP of Marketing & Operations, Optical Systems Division, Broadcom

(光學(xué)系統(tǒng)部 營銷與運營副總裁 博通)

  Manish Mehta is the Vice President of Marketing and Operations within the Optical Systems Division at Broadcom where he’s been with the team since 2019. In his role, he oversees global FAB locations and runs the local Marketing team in San Jose. Prior to Broadcom, Manish spent a majority of his career with Source Photonics from 2007 to 2019, ranging in a variety of positions from Technical Program Management to an EVP PLM. In accordance, he holds a Ph.D in Philosophy, Electrical and Electronics Engineering from UC Santa Barbara as well as a B.S. in Electrical and Electronics Engineering from the University of Texas, Austin.

  自2019年以來一直在該團(tuán)隊工作。在他的職位上，他監(jiān)督全球FAB地點并管理圣何塞的當(dāng)?shù)貭I銷團(tuán)隊。在加入Broadcom之前，Manish從2007年到2019年在Source Photonics度過了他職業(yè)生涯的大部分時間，擔(dān)任過從技術(shù)項目管理到執(zhí)行副總裁PLM的各種職位。他持有加州大學(xué)圣巴巴拉分校的哲學(xué)、電氣和電子工程博士學(xué)位，以及德克薩斯大學(xué)奧斯汀分校的電氣和電子工程學(xué)士學(xué)位。

  演講摘要

  Innovation in optical interconnects have enabled AI scale-out cluster sizes to exceed 100k xPUs. But the power, cost, and performance penalties of optical interconnects compared to copper interconnects still prevent optics from penetrating rack level applications. Furthermore, these drawbacks of traditional optics have also prevented increase of scale-up cluster sizes beyond 128 xPUs. But recent innovation in high density CPO and NPO solutions using both SiPh and VCSEL technology promise to remove the bottlenecks and enable optical interconnects to usher in the next phase of AI networking.

  光互連的創(chuàng)新使人工智能擴(kuò)展集群的規(guī)模超過了100k xpu。但是，與銅互連相比，光互連的功率，成本和性能損失仍然阻礙光學(xué)器件進(jìn)入機架級應(yīng)用。此外，傳統(tǒng)光學(xué)的這些缺點也阻礙了集群規(guī)模超過128 xpu的擴(kuò)展。但最近使用SiPh和VCSEL技術(shù)的高密度CPO和NPO解決方案的創(chuàng)新有望消除瓶頸，并使光互連迎來下一階段的人工智能網(wǎng)絡(luò)。

歡迎各位行業(yè)同仁報名參會!

  演講信息

  演講主題：Enabling the Next Generation of AI Connectivity: Very High Density and Low Power Optical

  演講嘉賓：Manish Mehta VP of Marketing & Operations, Optical Systems Division, Broadcom

  演講時間、專題：2025年9月9日， 09:25-09:45 主論壇一：AI算力驅(qū)動下的光通信革命

  演講地點：深圳國際會展中心洲際酒店

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